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buk208-50y; BUK213-50Y single channel high-side topfet? rev. 02 06 june 2002 product data 1. product pro?le 1.1 description monolithic temperature and overload protected single high-side power switch based on topfet? trench technology in a 5-pin surface mount or leadform plastic package. product availability: buk208-50y in sot263b-01 BUK213-50Y in sot426 (d 2 -pak). 1.2 features 1.3 applications 1.4 quick reference data n very low quiescent current n cmos logic capability n power trenchmos? n negative load clamping n overtemperature protection n overload protection n over and undervoltage protection n esd protection for all pins n reverse battery protection n diagnostic status indication n low charge pump noise n operating voltage down to 5.5 v n loss of ground protection n current limitation. n 12 and 24v grounded loads n high inrush current loads n inductive loads n replacement for relays and fuses. table 1: quick reference data symbol parameter min max unit r blon on-state resistance at 25 c - 100 m w i l continuous load current - 8.5 a i l(nom) nominal load current (iso) 3.6 - a i l(lim) limiting load current 12 24 a v bg operating voltage 5.5 35 v
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 2 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. 2. pinning information 2.1 pin description [1] it is not possible to make a connection to pin 3 of the sot426 package. [2] the battery is connected to the mounting base. fig 1. pinning; sot426 (d 2 -pak). fig 2. pinning; sot263b-01. fig 3. symbol; (hss) topfet tm . mbl431 12 4 3 mb 5 15 mb mbl264 03pa56 i s g b l p table 2: pin description symbol pin i/o description g 1 - circuit common ground i 2 i input b3- [1] [2] battery s 4 o status l 5 o load -mb- [2] mounting base
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 3 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. 3. block diagram 4. functional description [1] the status will continue to indicate ot (even if the input goes low) until the device cools below the reset threshold. see overtemperature protection characteristics in ta b l e 6 . fig 4. elements of the high-side topfet switch. 03pa33 r g input control logic undervoltage protection overvoltage protection low current detect temperature sensor short circuit protection current limit power mosfet load 5 battery 3/mb charge pump voltage regulator 2 ground 1 status 4 table 3: truth table abbreviations: l = logic low; h = logic high; x = dont care; 0 = condition not present; 1 = condition present; uv = undervoltage; ov = overvoltage; lc = low current or open circuit load; sc = short circuit; ot = overtemperature [1] . input supply load load output status operating mode uv ov lc sc ot l xxxxxoffhoff h 00000onhon & normal h 00100onlon & low current detect h 1 0 x x x off h supply undervoltage lockout h 0 1 x 0 0 off h supply overvoltage shutdown h 0001xofflsc tr ipped h 00001offlot shutdown
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 4 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. 5. limiting values [1] reverse battery voltage is only allowed with external resistors to limit the input and status currents to a safe value. the connected load must limit the reverse current. the internal ground resistor limits the reverse battery ground current. [2] to limit input current during reverse battery and transient overvoltages. [3] to limit status current during reverse battery and transient overvoltages. 6. thermal characteristics table 4: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v bg continuous supply voltage - 50 v i l continuous load current t mb 112 c - 8.5 a p tot total power dissipation t mb 25 c - 48 w t stg storage temperature - 55 +175 c t j junction temperature - 150 c t mb mounting base temperature during soldering ( 10 s) - 260 c reverse battery voltage v bg continuous reverse voltage [1] -16v v bg repetitive reverse voltage - 32 v external resistor r i external resistor [2] 3.3 - k w r s [3] 3.3 - k w input current i i continuous current - 5+5ma i i repetitive peak current d 0.1; t p = 300 m s - 50 +50 ma status current i s continuous current - 5+5ma i s repetitive peak current d 0.1; t p = 300 m s - 50 +50 ma inductive load clamping e bl(cl) non-repetitive clamping energy t j = 150 c prior to turn-off; i l = 2 a - 100 mj electrostatic discharge v esd electrostatic discharge voltage human body model; c = 100 pf; r = 1.5 k w -2kv table 5: thermal characteristics symbol parameter conditions min typ max unit r th(j-mb) thermal resistance from junction to mounting base - 2.1 2.6 k/w r th(j-a) thermal resistance from junction to ambient mounted on printed circuit board; minimum footprint; sot426 --50k/w
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 5 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. 7. static characteristics table 6: static characteristics limits are valid for - 40 c t mb +150 c and typical values for t mb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit clamping voltage v bg battery-ground voltage i g = 1 ma; figure 6 50 55 65 v v bl battery-load voltage i l =i g = 1 ma 50 55 65 v v lg negative load-ground i l = 10 ma; figure 12 and 14 - 18 - 23 - 28 v v lg negative load voltage i l = 2 a; t p = 300 m s [1] - 20 - 25 - 30 v supply voltage v bg operating range battery-ground 5.5 - 35 v current i b quiescent current v lg =0v; figure 10 [2] t mb = 150 c --20 m a t mb =25 c - 0.1 2 m a i l off-state load current v bl =v bg t mb = 150 c --20 m a t mb =25 c - 0.1 1 m a i g operating current figure 6 - 24ma i l(nom) nominal load current (iso) v bl = 0.5 v; t mb =85 c [3] 3.6 - - a resistance [4] r blon on-state resistance 9 v bg 35 v; i l =2a; figure 5 t mb =25 c - 80 100 m w t mb = 150 c - - 200 m w v bg =6v; i l =2a t mb =25 c - 100 125 m w t mb = 150 c - - 250 m w r g internal ground resistance i g = 10 ma 95 150 190 w input [5] i i input current v ig = 5 v 20 90 160 m a v ig input clamping voltage i i = 200 m a 5.5 7 8.5 v v ig(on) input turn-on threshold voltage figure 9 - 2.4 3 v v ig(off) input turn-off threshold voltage 1.5 2.1 - v d v ig input turn-on threshold hysteresis - 0.3 - v i i(on) input turn-on current v ig =3v - - 100 m a i i(off) input turn-off current v ig = 1.5 v 10 - - m a low current detection [6][9] i l(lc) low current detection threshold t mb = - 40 to +150 c 90 - 600 ma t mb =25 c; figure 15 150 300 450 ma d i l(lc) hysteresis - 60 - ma undervoltage [9] v bg(uv) low supply threshold voltage [7] 2 4.2 5.5 v
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 6 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. [1] for a high-side switch, the load pin voltage goes negative with respect to ground during the turn-off of an inductive load. [2] this is the current drawn from the supply when the input is low, and includes leakage current to the load. [3] de?ned as in iso 10483-1. for comparison purposes only. [4] the supply and input voltages for the r blon tests are continuous. the speci?ed pulse duration is t p = 300 m s, and refers only to the applied load current. [5] 9 v v bg 16 v [6] 9 v v bg 35 v. a low current load can be detected in the on-state. [7] undervoltage sensor causes the device to switch off and reset. [8] overvoltage sensor causes the device to switch off to protect the load. [9] see table 3 truth table [10] 5.5 v v bg 35 v [11] the battery to load threshold voltage for short circuit is approximately proportional to the battery supply voltage. [12] after cooling below the reset temperature the switch will resume normal operation. [13] the status output is an open drain transistor and requires an external pull-up circuit to indicate a logic high d v bg(uv) hysteresis - 0.5 - v overvoltage [9] v bg(ov) high supply threshold voltage [8] 40 45 50 v d v bg(ov) hysteresis - 1 - v overload protection [9] i l(lim) limiting load current v bg 3 9 v; v bl =v bg ; figure 8 [10] 12 18 24 a short circuit load protection [9][10] v bl(to) battery load threshold voltage v bg =16v; figure 11 [11] 8 1012v v bg = 35 v 15 20 25 v overtemperature protection [9][10] t j(to) threshold junction temperature [12] 150 170 190 c d t j(to) hysteresis - 10 - c status [5][9] v sg status clamping voltage i s = 100 m a 5.5 7 8.5 v v sg status low voltage i s = 100 m a; figure 7 t mb = - 40 c --1v t mb =25 c - 0.7 0.8 v i s status leakage current v sg =5v t mb = 150 c --15 m a t mb =25 c - 0.1 1 m a r s external pull-up resistor v sg =5v [13] -47-k w table 6: static characteristics continued limits are valid for - 40 c t mb +150 c and typical values for t mb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 7 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. i l = 2 a; v ig =5v fig 5. battery-load on-state resistance as a function of battery-ground voltage; typical values. v ig =5v fig 6. supply current characteristics: battery-ground operating current as a function of battery-ground voltage; typical values. 03pa54 0 0 120 200 40 80 160 20 30 40 10 r blon (m w ) v bg (v) t j = 150 c t j = 25 c t j = - 40 c 03pa55 25 75 clamping v bg (v) 50 0 1 2 3 4 0 i g (ma) undervoltage shutdown overvoltage shutdown t j = - 40 c t j = 25 c t j = 150 c
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 8 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. v bg = 13 v; v ig =5v;t j =25 cv bg = 16 v; v ig =5v;t j =25 c (the device trips after 200 m s, and the status goes low). fig 7. status current as a function of status-ground voltage; typical values. fig 8. load current limiting as a function of battery-load voltage; typical values. 9v v bg 16 v v bg =16v fig 9. input-source threshold voltage as a function of junction temperature. fig 10. supply quiescent current as a function of junction temperature; typical values. 03pa38 0 1 2 3 4 0 1 2 3 4 i s (ma) v sg (v) 03pa39 0 5 10 15 20 0 5 10 15 20 (a) v bl (v) i l v bl(to) 03pa36 1 1.5 2 2.5 3 3.5 -50 0 50 100 150 200 max min v ig (on) v ig (off) v ig (v) t j ( c) 03pa37 0 0.5 1 1.5 2 2.5 -50 0 50 100 150 200 i b ( m a) t j ( c)
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 9 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. 8. dynamic characteristics v ig =5v; - 40 c t j +150 c fig 11. battery-load threshold voltage as a function of battery-ground voltage. 03pa40 0 10 20 30 0 10 20 30 40 50 max typ min v bg (v) v bl(to) (v) table 7: switching characteristics t mb =25 c; v bg = 13 v; resistive load r l =13 w . figure 13 symbol parameter conditions min typ max unit turn-on measured from the input going high t d(on) turn-on delay time to 10% v l -5080 m s dv/dt on rising slew rate 30 to 70% v l - 0.5 1.0 v/ m s t on turn-on switching time to 90% v l - 85 160 m s turn-off measured from the input going low t d(off) turn-off delay time to 90% v l -5080 m s dv/dt off falling slew rate 70 to 30% v l - 0.8 1.2 v/ m s t off turn-off switching time to 10% v l - 70 120 m s table 8: status response times limits are valid for - 40 c t mb +150 c and typical values for t mb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit measured from when the input goes high t d(sc) short circuit response time v bl >v bl(to) ; figure 16 - 180 250 m s t d(lc) low current detect response time i l philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 10 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. table 9: capacitances t mb =25 c; f = 1 mhz; v ig =0v. symbol parameter conditions min typ max unit c ig input capacitance v bg =13v - 1520pf c bl output capacitance v bl = 13 v - 130 185 pf c sg status capacitance v sg = 5 v - 11 15 pf v bg = 13 v; v ig = 5 v and t j =25 c fig 12. schematic drawing of the switching circuit. fig 13. resistive switching waveforms and de?nitions. fig 14. switching a large inductive load. fig 15. low current detection waveforms. 03pa45 l l v l r l v sg v ig r i r s p v bg 0 v 0 03pa51 0 v 90% v ig v sg v l 5 v 5 v 10% t on t off dv/dt on dv/dt off 0 v 0.7 v 0 03pa50 0 v 0 v v ig v sg i l v l 5 v 5 v i l(lc) e bl(cl) 0 v 0.7 v 0 03pa48 0 v v ig v sg v l 5 v 5 v t d(lc) t off 10% 90% t on
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 11 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. v bl 3 v bl(to) fig 16. short circuit protection waveforms. 0 v 0.7 v 0 03pa49 0 v v ig v sg i l 5 v 5 v t d(sc)
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 12 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. 9. package outline epoxy meets ul94 v0 at 1/8. net mass: 1.5g. for soldering guidelines and surface mount footprint design, please refer to data handbook sc18. fig 17. sot426. references outline version european projection issue date iec jedec eiaj sot426 0 2.5 5 mm scale plastic single-ended surface mounted package (philips version of d 2 -pak); 5 leads (one lead cropped) sot426 e e e e e b a 1 a a 1 l p bc d max. e a unit dimensions (mm are the original dimensions) e 11 mm 4.50 4.10 1.40 1.27 0.85 0.60 0.64 0.46 2.90 2.10 h d 15.80 14.80 q 2.60 2.20 10.30 9.70 d 1 1.60 1.20 1.70 98-12-14 99-06-25 1 3 24 5 mounting base d 1 h d d q l p c
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 13 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. refer to mounting instructions for to-220 packages. epoxy meets ul94 vo at 1/8. net mass: 2g fig 18. sot263b-01. references outline version european projection issue date iec jedec eiaj sot263b-01 5-lead (option) to-220 d d 1 q l 15 l 3 mounting base l 4 m e q b 0 5 10 mm scale plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead to-220 lead form option sot263b-01 unit a 1 d 1 el ? p mm 1.7 l 1 l 2 q 3.0 2.7 4.5 4.1 1.39 1.27 0.85 0.70 0.7 0.4 15.8 15.2 6.4 5.9 10.3 9.7 9.8 9.7 5.9 5.3 5.2 5.0 2.4 1.6 0.8 0.6 3.8 3.6 p 1 4.3 4.1 q 1 q 2.0 4.5 q 2 8.2 r 0.5 w 0.4 dimensions (mm are the original dimensions) a b d c 0.5 l 3 (1) l 4 (2) max. e m a a 1 c q 1 q 2 notes 1. terminal dimensions are uncontrolled in this zone. 2. positional accuracy of the terminals is controlled in this zone. l 1 l 2 r r w m 01-01-11 ? p p 1 e
philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? product data rev. 02 06 june 2002 14 of 16 9397 750 09384 ? koninklijke philips electronics n.v. 2002. all rights reserved. 10. revision history table 10: revision history rev date cpcn description 02 20020606 - product data (9397 750 09384); supersedes product speci?cation buk208-50y_1 (rev 2.000) of march 2001 and product speci?cation BUK213-50Y_1 (rev 2.000) of march 2001. modi?cations: ? the format of this speci?cation has been redesigned to comply with philips semiconductors new presentation and information standard.
9397 750 09384 philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? ? koninklijke philips electronics n.v. 2002. all rights reserved. product data rev. 02 06 june 2002 15 of 16 9397 750 09384 philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? ? koninklijke philips electronics n.v. 2002. all rights reserved. product data rev. 02 06 june 2002 15 of 16 contact information for additional information, please visit http://www.semiconductors.philips.com . for sales of?ce addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com . fax: +31 40 27 24825 11. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. 12. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 13. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 14. trademarks topfet is a trademark of koninklijke philips electronics n.v. trenchmos is a trademark of koninklijke philips electronics n.v. data sheet status [1] product status [2] de?nition objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be publish ed at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a.
? koninklijke philips electronics n.v. 2002. printed in the netherlands all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 06 june 2002 document order number: 9397 750 09384 contents philips semiconductors buk208-50y; BUK213-50Y single channel high-side topfet? 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 functional description . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 4 7 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 8 dynamic characteristics . . . . . . . . . . . . . . . . . . 9 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 11 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 12 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 13 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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